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Norm
ÖVE/ÖNORM EN 62047-15
Ausgabedatum: 2016 03 01
Semiconductor devices - Micro-electromechanical devices -- Part 15: Test method of bonding strength between PDMS and glass (IEC 62047-15:2015) (english version)
This part of IEC 62047 describes test method for bonding strength between poly dimethyl
siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for building of c...
Weiterlesen
ZURÜCKGEZOGEN
: 2022 01 02
Herausgeber:
Austrian Standards International
Format:
Digital | 20 Seiten
Sprache:
Englisch
Fachgebiete
IT, communication & electronic, Electromechanical components for electronic and telecommunications equipment, Electromechanical components in general
IT, communication & electronic, Electronic components, Other semiconductor devices
IT, communication & electronic, Electronic components, Semiconductor devices in general
Electric & lighting engineering, Electromechanical components for electronic and telecommunications equipment, Electromechanical components in general
This part of IEC 62047 describes test method for bonding strength between poly dimethyl
siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for building of chip-based
microfluidic devices fabricated using lithography and replica moulding processes. The
problem of bonding strength is mainly for high pressure applications as in the case of certain
peristaltic pump designs where an off chip compressed air supply is used to drive the fluids in
micro channels created by a twin layer, one formed by bondage between glass with replica
moulded PDMS and another between PDMS and PDMS. Also, in case of systems having
pneumatic microvalves, a relatively high level of bonding particularly between two replica
moulded layers of PDMS becomes quite necessary. Usually there is a leakage and debonding
phenomena between interface of bonded areas, which causes unstability and shortage of
lifetime for MEMS devices. This standard specifies general procedures on bonding test of
PDMS and glass chip.
ÖVE/ÖNORM EN 62047-15
2016 03 01
Semiconductor devices - Micro-electromechanical devices -- Part 15: Test method of bonding strength...
Norm
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