Jetzt anpassen und kaufen
232,70 €
exkl. USt.
Konfigurieren
Norm
ÖVE/ÖNORM EN 60068-2-58
Ausgabedatum: 2016 03 01
Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2015) (english version)
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD).
This standard provides procedures for determining the solderability and resistance...
Weiterlesen
ZURÜCKGEZOGEN
: 2021 04 02
Herausgeber:
Austrian Standards International
Format:
Digital | 46 Seiten
Sprache:
Englisch
Aktuell Gültig:
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD).
This standard provides procedures for determining the solderability and resistance to
soldering heat of devices in applications using solder alloys, which are eutectic or near
eutectic tin lead (Pb), or lead-free alloys.
The procedures use either a solder bath or reflow method and are applicable only to
specimens or products designed to withstand short term immersion in molten solder or limited
exposure to reflow systems.
The solder bath method is applicable to SMDs designed for flow soldering and SMDs
designed for reflow soldering when the solder bath (dipping) method is appropriate.
The reflow method is applicable to the SMD designed for reflow soldering, to determine the
suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not
appropriate.
The objective of this standard is to ensure solderability of component lead or termination. In
addition, test methods are provided to ensure that the component body can resist against the
heat load to which it is exposed during soldering.
This standard covers tests Td1, Td2 and Td3 as listed below:
Number of Td Test Method
Td1 Solderability of terminations
Method 1: Solder bath
Method 2: Reflow
Td2 Resistance to soldering heat
Method 1: Solder bath
Method 2: Reflow
Td3 Dewetting and resistance to dissolution of metallization
Method 1: Solder bath
Method 2: Reflow
NOTE 1 For specific components other test methods may exist.
NOTE 2 Test Td does not apply to printed wiring board (PWB), see IEC 61189-3.
NOTE 3 Specific through-hole devices (where the device supplier has specifically documented support for reflow
soldering) are also included in this standard.
OVE EN 60068-2-58
2018 10 01
Umgebungseinflüsse -- Teil 2-58: Prüfungen – Prüfung Td: Prüfverfahren für Lötbarkeit, Widerstandsf...
Norm
OVE EN 60068-2-58
2018 10 01
Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to ...
Norm
ÖVE/ÖNORM EN 60068-2-58
2016 03 01
Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to ...
Norm
↖
ÖVE/ÖNORM EN 60068-2-58
2005 04 01
Umweltprüfungen - Teil 2-58: Prüfungen - Prüfung Td: Prüfverfahren für Lötbarkeit, Widerstandsfähigk...
Norm
ÖVE/ÖNORM EN 60068-2-58
2000 01 01
Umweltprüfungen - Teil 2-58: Prüfungen - Prüfung Td: Prüfverfahren für Lötbarkeit, Widerstandsfähigk...
Norm
ÖVE HD 323.2.58 S1
1991 06 04
Basic environmental testing procedures - Part 2: Tests - TestTd: Solderability, resistance to dissol...
Technische Regel
Norm
ISO 9454-2:1998
Ausgabedatum :
1998 08 20
Soft soldering fluxes — Classification and requirements — Part 2: Performance requirements
Norm
OVE EN 60068-2-58
Ausgabedatum :
2018 10 01
Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2015 + A1:2017) (english version)
Norm
OVE EN 60068-2-58
Ausgabedatum :
2018 10 01
Umgebungseinflüsse -- Teil 2-58: Prüfungen – Prüfung Td: Prüfverfahren für Lötbarkeit, Widerstandsfähigkeit gegenüber Auflösen der Metallisierung und Lötwärmebeständigkeit bei oberflächenmontierbaren Bauelementen (SMD) (IEC 60068-2-58:2015 + A1:2017) (deutsche Fassung)