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Norm
ÖVE/ÖNORM EN 62047-18
Ausgabedatum: 2014 06 01
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013) (english version)
Gültig
Herausgeber:
Austrian Standards International
Format:
Digital | 22 Seiten
Sprache:
Englisch
Fachgebiete
IT, communication & electronic, Electromechanical components for electronic and telecommunications equipment, Electromechanical components in general
IT, communication & electronic, Electronic components, Other semiconductor devices
IT, communication & electronic, Electronic components, Semiconductor devices in general
Electric & lighting engineering, Electromechanical components for electronic and telecommunications equipment, Electromechanical components in general
ÖVE/ÖNORM EN 62047-18
2014 06 01
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film...
Norm
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