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Norm

ÖVE/ÖNORM EN 60191-6-22

Ausgabedatum: 2013 10 01

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012) (english version)

This part of IEC 60191 provides the outline drawings and dimensions common to siliconbased package structures and materials of ball grid array packages (BGA) and land gr...
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Herausgeber:
Austrian Standards International
Format:
Digital | 24 Seiten
Sprache:
Englisch
ICS
31.080.01 01.100.25 31.240
Fachgebiete
IT, communication & electronic, Electronic components, Mechanical structures for electronic equipment IT, communication & electronic, Electronic components, Semiconductor devices in general Mechanical engineering foundations & materials, Technical drawing and graphical symbols, Electrical and electronics engineering drawings Services & management, Technical drawing and graphical symbols, Electrical and electronics engineering drawings
This part of IEC 60191 provides the outline drawings and dimensions common to siliconbased package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
ÖVE/ÖNORM EN 60191-6-22
2013 10 01
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation o...
Norm
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