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Norm

ÖVE/ÖNORM EN 62137-3

Ausgabedatum: 2012 10 01

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011) (english version)

This part of IEC 62137 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface ...
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This part of IEC 62137 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys.
ÖVE/ÖNORM EN 62137-3
2012 10 01
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test met...
Norm